From semiconductor wafers and substrates to optical lenses and ceramics, achieving flat, smooth, defect-free surfaces is critical.
Lapping and polishing are some of the most complex and sensitive process steps in precision manufacturing. Whether you're planarizing a silicon wafer or polishing sapphire optics, your slurry system must deliver consistent material removal and defect-free finishes—without damaging fragile materials or overcomplicating post-process cleaning.
Even slight instability in a slurry system can result in increased defectivity, yield loss, and costly downtime.
Intersurface Dynamics delivers water-based slurries, vehicles, and additives engineered to meet the most demanding lapping and polishing requirements—while providing chemical stability, material compatibility, and process efficiency.
IDI offers a portfolio of aqueous slurries, slurry vehicles, and additives for both loose and fixed abrasive polishing. Each is optimized by application to support stable particle suspension, efficient material removal, and defect minimization across a wide range of substrates and equipment platforms.
Solutions that are optimized by application to ensure material compatibility
Robust quality systems that address the needs of a wide range of demanding industries
Aqueous chemistries for cost effective processes and convenient disposal
Custom development to meet exact process specifications
Suspension-Type Lapping Vehicles
- Viscous, biodegradable polymer/surfactant blends that fully suspend abrasives like alumina and silica
- Engineered for semiconductor substrates, ceramics, and optics
- Maintain suspension and dispersion over long intervals, reducing the need for constant mixing
Our suspension-type lapping slurries, including those in the Vector HTS Series, are biodegradable, viscous polymer/surfactant blends designed to disperse and suspend abrasives like aluminum oxide and silicon dioxide when mixed with de-ionized water. Engineered for the lapping of semiconductor substrates, these slurries fully disperse and suspend abrasive material for extended periods of time with relatively little change in physical or chemical characteristics. Designed for use on all types of lapping plates and tool-sets.
Products within the HTS series have varied chemical and physical properties, resulting in differences in wetting, film strength and viscosity. This allows the formulation to be optimized for any application.
Key Products:
Vector HTS Series
Challenge 550 Series
Challenge 543-HT
Diamond Polishing Systems
- Thixotropic vehicles for dispersing diamond abrasives, ideal for hard crystalline materials like SiC, sapphire, and GaN
- Available as base vehicles or ready-to-use slurries with diamond powder
- Deliver reduced scratching, improved cut rate, and flatter surfaces—while simplifying post-lap cleanup
Benefits of Vector TXT and CE Diamond slurries include flatter wafers with reduced damage, cut-rate enhancement, reduced scratching, reduced abrasive usage, stain prevention and more consistent results. Additionally, because the products are water soluble, post-lap cleaning is much easier. Lapping vehicles are also compatible with all other Intersurface Dynamics products.
Key Products:
Vector TXT Series
Vector CE Diamond Slurries
Custom CMP Slurries
- Fully formulated slurries for Chemical Mechanical Planarization (CMP)
- Tailored for advanced semiconductor devices and packaging
- Available with custom abrasive systems, pH control, and surface modifiers
Key Products:
Custom CMP Slurries
Application areas:
We work closely with customers to co-develop lapping and polishing chemistries optimized for their specific equipment, materials, and goals.
Whether you're solving for yield, surface integrity, or tool compatibility, we can formulate a solution that supports your process end-to-end.
Collaborate with our experts to tailor a solution for your exact process
We offer a wide range of proven surface chemistry products—but we’re equally invested in working with customers to develop new, customized solutions tailored to address new material types, integration challenges, or process innovations.
IDI can assist with method development for preparing wafer surfaces for:
- Downstream processing
- Wafer to wafer bonding
- Epitaxy
- Processes requiring ultra low surface roughness
Projects IDI can assist with:
- Unmet consumable technology needs
- POR chemistry discontinuation/obsolescence
- Importation challenges
- Consumables compliant with defense procurement restrictions
Common Applications
MADE IN THE USA
More than a supplier — we're a trusted extension of your team
IDI brings more than 40 years of hands-on experience solving real-world process challenges. Our products are manufactured in the U.S., with fast lead times, responsive support, and a collaborative approach that ensures the chemistry fits your process—not the other way around.
IDI is more than a supplier—we're a trusted extension of your team, focused on helping you solve challenges and improve results. We work closely with you to recommend, refine, or custom-develop solutions that optimize performance, reduce waste, and keep your operations running smoothly.
Get the Right Chemistry for Your Process
We specialize in application-specific solutions—tailored to your materials, process, and performance goals. Whether you need help selecting the right product or developing a custom formulation, our experts are here to help.
Intersurface Dynamic’s Bethel, CT manufacturing facility is ISO-9001:2015 registered. This commitment to quality combined with our advanced manufacturing techniques has produced a record of reliable and timely service for for our customers.
Expert Solutions, Engineered for You
Specialized Solutions for Advanced Semiconductor Fabrication
Amtech Semiconductor Fabrication Solutions is a division of Amtech Systems, Inc., a global provider of equipment and materials for the semiconductor industry. This segment supplies capital equipment and consumables used throughout the semiconductor fabrication process—including advanced packaging and electronics manufacturing—covering everything from substrate processing to final assembly.
The Intersurface Dynamics, Entrepix, and PR Hoffman brands of Amtech Semiconductor Fabrication Solutions stand out for their commitment to custom solutions — whatever the customer needs, they deliver. Beyond customization, their competitive edge lies in responsiveness emphasizing quick turnaround times to meet customer demands. Additionally, each brand operates with a deep, process-specific focus, bringing together specialists within closely related fields. This structure ensures that customers benefit from true expertise tailored to their specific manufacturing challenges.
At Amtech Semiconductor Fabrication Solutions, we empower your manufacturing process through expert collaboration. Our specialized subsidiaries—Intersurface Dynamics, PR Hoffman, and Entrepix—bring unparalleled expertise in application-specific chemicals, polishing and lapping templates, and CMP-related upgrades. As a nimble and responsive company, we excel in forming rapid partnerships, allowing us to customize solutions that address your unique challenges. Together, we enhance every critical step of your semiconductor, compound semiconductor, and substrate manufacturing processes, driving innovation and precision.
Semiconductor Substrate Manufacturing Process
Input Substrate
- Si (silicon)
- SiC (silicon carbide)
- GaN (gallium nitride)
- GaAs (gallium arsenide)
- InP (indium phosphide)
- Glass
- Sapphire
Output
Finished Wafer or Substrate
Featured Products
Get the Right Chemistry for Your Process
Tailored solutions start with a conversation. Whether you need help selecting a product or developing a custom formulation, our experts are here to help.