VECTOR Series C-E Diamond Slurries
C-E Diamond Slurry Developed Specifically for Silicon Carbide
VECTOR Series C-E Diamond Slurries are aqueous, synthetic formulations developed to optimize material removal rate (MRR, see Figure 1a below) and surface finish (Figure 1b-c and Figure 2) when polishing silicon carbide (SiC) with a pad.
The slurries are suspended for easy application from the slurry tank to the workpiece via a peristaltic pump. Slight agitation is required prior to use, while constant, low-speed mixing is recommended during run cycles.
Figure 1. a) MRR in microns per hour, b) Average Roughness (Ra) in angstroms (Å), and c) Maximum Peak-to-Valley Roughness (Rmax) in Å of SiC using 0-2 μm or 2-4 μm, polycrystalline diamond. Results are typical of SiC wafers polished on PR Hoffman Servo RS Series machines fitted with Suba 800 pads.
Typical Properties:
- pH – 7.9
- Conductivity mS/cm – 4.6
- Specific Gravity – 1.03
Figure 2. Typical profilometric scans of SiC surface after 1 h polish with Vector Series C-E Diamond Slurry using a) 0-2 μm or b) 2-4 μm diamonds.
Directions:
VECTOR Series C-E Diamond Slurries are designed for use as received. The flow rate is determined by the size and configuration of the pad.
Additional Information:
VECTOR Series Diamond Slurries are available in 1-gallon bottles, 2.5-gallon bottles, 5-gallon pails, and 55-gallon drums. Safety Data Sheets are available upon request.
Benefits:
Better surface finishes
Faster removal rates
High lubricity
Contains no glycols or oils
Non-corrosive to ferrous metals