TENSOR DG Series Products are aqueous detergents formulated to facilitate the removal of organic and inorganic films, combinations of films, particles and debris from the surface of the substrate. When the correct TENSOR DG Series Product is selected, corrosion/oxidation of films and/or interconnect structures is eliminated. These products are designed to be diluted with water at levels between 2-5% resulting in extremely safe, economical and environmentally sensitive solutions to difficult cleaning problems. TENSOR DG Series Products may be used in processes employing passivation rinses, brush cleaning, spray cleaning, ultrasonic and megasonic cleaning (heated or unheated). The products may be used in combination with existing cleans to make the process more robust. TENSOR DG Series applications include post-CMP, passivation rinses, CMP buff, post–etch/ash cleaning, post–etch/ash rinsing, and wherever surfaces need to be cleaned or rinsed prior to the additional processing.

Benefits

• Superior wetting ability and corrosion/oxidation inhibition
• Free rinsing – leaves no film or residue
• Fully compatible with metal interconnect structures and packaging
• Safe and economical to use

Additive For High Pressure Pad Rinse/Wafer De-Chucking Cycles

Tensor D-Rinse is a specially formulated additive designed for use in high-pressure pad rinse and wafer de-chucking systems of today’s CMP tools.

When added to the rinse water at concentrations between 10% and 25% Tensor D-Rinse will reduce light scratching produced during the high-pressure rinse/de-chucking cycle. Tensor D-Rinse will also facilitate removal of slurry chemistry, particles and pad residues, thus increasing the effectiveness of post-CMP (megasonic and brush) wafer cleaning processes. Tensor D-Rinse is formulated to eliminate corrosion/oxidation of metals that can occur during wafer transport to 2nd and 3rd phases as well as delayed transport to the cleaning station.

Benefits

• Superior wetting with low foam
• Free rinsing – leaves no films or residue
• Cleans residues left by any commercially available CMP slurries
• Fully compatible with advanced metal schemes and associated dielectrics
• Fully compatible with all industry standard CMP tools and pad rinsing/wafer de-chucking systems
• Easily implemented
• Safe and economical to use

Dicing/Back-Grinding Coolants/Lubricants With Anti-Corrosion Additives

As Back-End IC processing and packaging becomes more integral to the performance of electronic devices, optimization of legacy back-end processes becomes critical. Important legacy processes are dicing (singulation), back-grinding (thinning) and CMP.

Intersurface Dynamics historically has helped to extend an array of legacy processes for use in the production of these more value added parts through the development of complex chemistry that solves process and material issues. Different more complex wafers/die/packaging design and materials can be more easily processed with defect reduction and yield improvement through the simple integration of one of the three TENSOR HTD Series Products.

TENSOR HTD, HTD-2 and HTD-3 are each a specially formulated chemical product performing as a combination coolant/lubricant/corrosion inhibitor when dicing/back-grinding semiconductor devices and packaging. Three product variations exist to enable a precise match to different process requirements and parameters.

Benefits:

• Simplify/eliminate post-process cleaning by reducing saw dust/debris from the wafer/die/package surface.
• Reduce IC defects caused by chipping during dicing.
• Reduce de-lamination through package stress reduction during dicing.
• Reduce bonding defects caused by metal oxide formation on bond pad surfaces by eliminating corrosion/oxidation of exposed metals during dicing/back-grinding.
• Extend saw blade/grinding wheel life by keeping the bond/diamond matrix clean.
• Increase grind uniformity and reduce surface roughness of wafers TSV/TWV by allowing uniform and proper wear of the grinding wheel.
• Eliminate electrical defects through prevention of galvanic corrosion.

Alumina, Ceria And Zirconia Slurries For Cmp Planarization

TENSOR-AP Series Products are abrasive slurries made of tightly sized, high purity, sub-micron metal-oxide particles.  The slurries are dispersed in a special polymer matrix with wetting agents and flow control additives.  Each product is to be mixed with deionized water from between 10% to 60%, dependent on the specific application and the polishing pad.

TENSOR-AP Series Products are to be used with common oxidizers or, for the most difficult applications, with Intersurface Dynamics’ APX Series of Slurry Modifying Additives.  There are 4 different slurries from which to choose.  AP/4 and AP/6 are alumina slurries that differ in particle size and particle distribution.  TENSOR AP/7 is a high-purity ceria slurry and TENSOR AP/8 is a high- purity zirconia slurry.  Each slurry is suitable for different metals and design layouts.

The slurries are diluted with DI water and an oxidizer and/or an APX Slurry Modifying Additive, for specific metal schemes and design layouts.  Special consultation should occur with an IDI technical representative for the correct recommendation on specialized projects to achieve satisfactory results.

Benefits:

• Adjustable removal rate of films
• Adjustable selectivity to barrier and oxide
• With the correct APX additive, no corrosion of liner materials
• Fast planarization of topography before breakthrough to barrier
• Low defectivity on metal and oxide
• Fully compatible with low k dielectrics
• Do not contain BTA
• Safe and economical to use
• ISO certified program
• Certificates of Compliance available on every shipment

“Once-Through” Non Re-Circulating Synthetic Coolant/Lubricant For Fixed Diamond Abrasive Cropping, Squaring, and Wafering Of Silicon Ingots Using Id, Band And Wire Saws. May Also Be Used As A Non Re-Circulating Edge Grinding Coolant/Lubricant

VECTOR HTI-1.1 is a synthetic formulation developed for use in “once-through” processes using diamond blades or diamond wires. With its exceptional heat transfer capability, VECTOR HTI-1.1 quickly cools the diamond blades or wires for longer diamond life, while the product’s superior detergency keeps the diamond interface clean and free cutting for both increased cutting speed and reduced blade or wire deflection.

For producers of solar silicon wafers, VECTOR HTI-1.1 is recommended as a once-through coolant for cropping and squaring silicon slabs and ingots. VECTOR HTI-1.1 allows consistent, sustainable cutting at the higher speeds typical of diamond wire cropping and squaring saws. VECTOR HTI-1.1 can also be used as non re-circulating coolant for edge grinding silicon ingots and wafers.

VECTOR HTI-1.1 is for use in “once-through” systems only.

Benefits:

• Extended blade and wire life
• Increased production
• Lowest sub-surface damage
• Less bow and warp
• Reduced blade and wire deflection
• Elimination of exit chipping
• Elimination of substrate tear
• Cleaner machines and working conditions
• Non-staining, non-corrosive and odor-free

Synthetic Grinding Fluid

VECTOR HTG is a synthetic formulation developed to optimize removal rate and surface finish in grinding, sawing, and dicing processes using diamond grinding wheels and blades. The product’s exceptional heat transfer characteristics insure prolonged diamond life. VECTOR HTG is compatible with all filtration systems, and its foam-free operation promotes operator acceptance.

Benefits:

• Better surface finishes
• Faster removal rates
• No foam
• Extended diamond life
• Non-staining
• Compatible with all filtering systems
• Non-corrosive
• Operator acceptance

Lapping/Polishing Slurry Additives For Semiconductor Materials

HTS-1.3 EU | HTS-1.4 EU |  HTS-3

Vector HTS Series Products are biodegradable, viscous, polymer/surfactant mixtures formulated to be used with Aluminum Oxide (either PWA type or FO Type) and de-ionized water to form a suspension-type lapping slurry.  Designed primarily for use in lapping silicon wafers, Vector HTS Series Products fully disperse and suspend abrasive material for extended periods of time with relatively little change in physical or chemical characteristics. Designed for use on all types of lapping plates, the products perform particularly well with serrated or grooved plates. The HTS Series Products differ chemically and physically, resulting in differences in wetting, film strength and viscosity. Allow an HTS Series Product to be specified by an Intersurface Dynamics trained sales engineer. Some of the variables that effect HTS Series Product choice include: type of lapping plates; type of pumping system; brand of machine; operating pressure; and type of abrasive.  A choice of Vector HTS Series Products provides the user with precisely the correct chemistry for achieving optimum results from a lapping process.

Benefits:

• Produces flatter wafers
• Reduces wafer damage
• Increases cut rate
• Helps to eliminate scratching
• Facilitates post-lapping cleaning
• Provides more consistent results
• Helps prevent wafer staining
• Reduces abrasive use

Additive For Rinsing Post-Lapped, Post-Polished, Post-Sawed (Cropping, Squaring, Wafering) And Post-Textured Silicon Wafers Including Multi-Crystal And Single Crystal Wafers For Pv Applications

VECTOR HTR is a synthetic formulation developed for the rinsing and wet storage of substrates after lapping, polishing, sawing or texturing. Used as directed, VECTOR HTR minimizes scratching from in-process handling; protects substrates from staining; and prevents hard-to-clean slurry residues from adhering to the substrate surface for more effective downstream cleaning.  VECTOR HTR is recommended for use on mono-crystalline and multi-crystalline silicon.

For solar silicon producers, VECTOR HTR is used to rinse excess slurry residues from wafers post-wire sawing. Before demounting, the wafers are rinsed with a solution of 3% to 4% VECTOR HTR and DI water to eliminate staining and improve final cleaning results. Vector HTR is also used to wet-store wafers after demounting and prior to cleaning.

For semiconductor silicon producers, VECTOR HTR is recommended for the rinsing/washing of lapping plates. VECTOR HTR removes process debris from both the plate’s surface and grooves, thereby preventing the formation of iron oxide/abrasive particle aggregates that can dislodge and cause scratching. When used for rinsing/washing polishing pads, VECTOR HTR prevents staining; increases pad life by keeping the pore structure open; and reduces the frequency of pad conditioning.

Benefits:

• Highly economical when used as directed
• Reduces scratching due to plate/pad contamination
• Minimizes plate/pad cleaning and maintenance
• Minimizes scratching from in-process handling
• Prevents staining
• Facilitates downstream cleaning processes

Ultrasonic/Megasonic Detergents

VECTOR HTC-SCA Series are water-based detergents formulated to increase the cavitational energy released upon the substrate surface by ultrasonic or megasonic apparatus.  The products are designed for more effective cleaning of post-lapped, post-etched and post-polished substrates. Used at economical dilution ratios, VECTOR HTC-SCA Series will remove light organics, polymers and sub-micron particles typically found on the surface of semiconductor materials.  These contaminants are often the cause of wafer staining and streaking upon examination after etch.

VECTOR HTC-SCA Series detergents are recommended for pre-cleaning and final cleaning stages of solar silicon production lines, wherever ultrasonic cleaning is applied. These products will remove organic and inorganic contamination and particles from both mono-crystalline and multi-crystalline silicon.

VECTOR HTC-SCA Series can be used in heated or unheated ultrasonic tanks, and are also recommended for brush and dip tank applications.

There are 6 Products in the SCA Series: VECTOR HTC-SCA,  VECTOR HTC-SCA-1, VECTOR HTC-SCA-13 N, VECTOR HTC-SCA-13-NT, VECTOR HTC-SCA-2 and VECTOR SCA-13.

Benefits:

• Superior wetting ability
• Free rinsing – leaves no film or residue
• Fully compatible with other VECTOR products
• Economical to use and easy to filter

VECTOR Series Diamond Slurries are completely dispersed suspensions of accurately sized synthetic polycrystalline diamonds. The suspension chemistry is composed of aqueous based synthetic surfactants, polymers and lubricants developed to optimize removal rate and surface finish when lapping and polishing materials such as SiC and Sapphire. The slurries can be used on either a lapping plate or a polishing pad. The slurries are fully suspended and dispersed for easy application from the slurry tank to the workpiece via a peristaltic pump.
The slurries’ extreme lubricity qualities allows for use of higher speeds and pressures during the process while continuing to exhibit exceptionally accurate defect free finish down to 2 angstroms.

Particle sizes are available from 0.5um to 12um and are chosen dependent upon surface roughness and removal rate required. When purchasing a VECTOR Series Diamond Slurry, please specify diamond size or consult a sales engineer.

Typical Applications:

Lapping or polishing a variety of hard ceramics, SiC and Sapphire.

Benefits:

Better surface finishes
Faster removal rates
High lubrication
Low foam
Non-staining
Contains no glycols or oils
Non-corrosive to ferrous metals

Synthetic Grinding Fluids

CHALLENGE 300-Series Products are synthetic formulations developed to optimize removal rate and surface finish in grinding, sawing, and dicing processes using diamond grinding wheels and blades. The product’s exceptional heat transfer characteristics insure prolonged diamond life, even with the most difficult materials. CHALLENGE 300-Series Products are compatible with all filtration systems, and its foam-free operation promotes operator acceptance.

Benefits:

• Better surface finishes
• Faster removal rates
• No foam
• Extended diamond life
• Non-staining
• Compatible with all filtration systems
• Non-corrosive
• Operator acceptance

Synthetic Grinding Fluids for Ceramic and Optical Materials

CHALLENGE 300-HT is an aqueous-based synthetic formulation developed to optimize removal rate and surface finish in grinding, sawing, and dicing processes using diamond grinding wheels and blades. The product’s exceptional heat transfer characteristics insure prolonged diamond life, even with the most difficult materials. CHALLENGE 300-HT is compatible with all filtration systems, and its foam-free operation promotes operator acceptance.

Benefits:

• Better surface finishes
• Faster removal rates
• No foam
• Extended diamond life
• Non-staining
• Compatible with all filtration systems
• Non-corrosive
• Operator acceptance

Synthetic Generating Coolant for Plastic and Glass Lenses

CHALLENGE 300-CR is a synthetic formulation developed to optimize removal rate and surface finish in generating or edging processes involving plastic (CR39, high-index, polycarbonate) and glass ophthalmic lenses. This versatile usage produces significant cost savings. The product’s exceptional heat transfer characteristics also ensure prolonged diamond life. CHALLENGE 300-CR provides rapid settling and is compatible with all filtration systems. CHALLENGE 300-CR eliminates the problem of plastic swarf floating on the top of the coolant.

Benefits

• Versatile – for both plastic and glass lenses
• Better surface finishes
• Faster removal rates
• Problem-free filtration with all systems
• Extended diamond life
• Operator acceptance
• Low foaming
• Operator acceptance

Synthetic Grinding Fluid for Ceramic and Optical Materials

CHALLENGE 310-HT is a synthetic formulation developed to optimize removal rate and surface finish in grinding, sawing, and dicing processes using diamond grinding wheels and blades. The product’s exceptional heat transfer characteristics insure prolonged diamond life, even with the most difficult materials. CHALLENGE 310-HT has an added characteristic of enhanced detergency that helps to keep the machine and work area more clean of grinding swarf and debris. The product is compatible with all type filtration systems allowing for extended use. Although it is a moderate foaming product it will still promote easy application providing a laminar flow of coolant to the wheel/work-piece interface for fine finishes and prolonged tool life.

Benefits

• Better surface finishes
• Faster removal rates
• Extended diamond life
• Non-staining
• Compatible with all filtration systems
• Non-corrosive to ferrous metals
• Operator acceptance

Lapping/Polishing Slurry Additive For Suspending Non-Treated Abrasive

Challenge 543-HT is a medium viscosity lapping/polishing slurry additive which evenly disperses and suspends a variety of non-suspension-treated abrasives, including aluminum oxide, zirconium oxide, silicon carbide, boron carbide, synthetic and natural diamond, and garnet. Because of its superior suspension characteristics, Challenge 543-HT reduces the amount of abrasive grain needed by up to 50%, while providing equal, and often greater, stock removal rates. 543-HT is particularly effective when using equipment with smaller slurry feed tubes, which constrict flow of high viscosity products.

Benefits:

• Flatter parts
• No scratching
• Less sub-surface damage
• Easier post-lap cleaning
• Increased removal rate
• More consistent results
• Reduced abrasive usage

Non-Suspension Type Lapping/Polishing Slurry Additive for Recirculating Systems

Challenge 550-HT was developed for use in “high-speed recirculating” slurry application
during lapping and polishing processes. Utilizing the energy of a high speed circulating
pump, standard on most lapping machines, it evenly disperses aluminum oxide, cerium
oxide, silicon carbide, boron carbide, and garnet abrasive. It also reduces abrasive
usage by eliminating “hard-packing” of the abrasive in the slurry tank and the slurry
lines. Using CHALLENGE 550-HT will also produce cleaner parts making the downstream
cleaning line more efficient.

Benefits:

• No scratching
• Less sub-surface damage
• No hard-packing
• Less abrasive waste
• Increased removal rate
• Easier post-lap cleaning
• Non-corrosive to machine

Suspension Type Lapping Slurry Additive
for Sapphire, Silicon Carbide, and Ceramic Materials

CHALLENGE 365-HT is an aqueous based additive designed to be mixed with DI water and abrasive to form a homogenous suspension used to lap/polish hard crystal materials and ceramics. Typically used at a concentration of between 10% and 20% with DI water, CHALLENGE 365-HT will provide a true suspension for up to 1 year depending upon the concentration used and the surface chemistry of the abrasive.

CHALLENGE 365-HT provides for laminar consistent flow of slurry throughout the lapping plate or polishing pad. Abrasives such as Diamond, SiC, B4C and Alumina are typcally first dispersed in DI water and then the CHALLENGE 365 HT is added.

Slurries created with CHALLENGE 365-HT are designed to be used once-through and not re-circulated. However, systems have been designed to re-use the slurry by adding additional 365-HT and abrasive to the used slurry to achieve the needed characteristics

CHALLENGE 365-HT is also designed to be used with diamond impregnated lapping/polishing pads for increased removal rate.

Benefits:

• Increase in removal rate compared to conventional slurries
• Excellent long term suspensions
• High lubricity
• Superior wetting ability
• Scratch free surfaces with optimum surface finish and flatness
• Free rinsing and easy to clean
• No odor
• Fully compatible with other CHALLENGE Series and VECTOR Series products
• Biodegradable

SLURRY ADDITIVE FOR CERIUM AND ALUMINUM OXIDE POLISHING SLURRIES

CHALLENGE 557-HT is an aqueous based slurry additive designed to be added to cerium
oxide and aluminum oxide polishing slurries. The nature of polishing slurries and
their sub-micron particle sizes creates post-polish cleaning issues. High precision
optical parts may be polished to the correct specifications using standard slurries
but cleaning the slurry particles from the surface of the parts is difficult and can
result in damaged or rejected parts. Adding CHALLENGE 557-HT to the polishing slurry
allows for that slurry to be more easily cleaned from the glass or ceramic surface.
Also, CHALLENGE 557-HT eliminates staining issues and burnishing marks. CHALLENGE
557-HT may also be used with other polishing slurries for similar results.

Benefits:

• Better dispersions
• Eliminates staining
• Less sub-surface damage
• Easier post-polish cleaning
• Non-corrosive to machine

Additive For Post-Lap/Polish Rinse And In-Process Wet Storage Of Parts

Challenge 700-HT is a synthetic formulation developed for the rinsing and wet storage of lapped/polished parts. Challenge 700-HT minimizes scratching from in-process handling; protects parts from staining; and prevents hard-to-clean particles from adhering to the part surface for more effective downstream cleaning. Also recommended for the rinsing/washing of lapping plates, Challenge 700-HT removes process debris from both the plate’s surface and grooves, thereby preventing the formation of iron oxide/abrasive particle aggregates that can dislodge and cause scratching. When used for rinsing/washing polishing pads, Challenge 700-HT prevents staining; increases pad life by keeping the pore structure open; and reduces the frequency of pad conditioning.

Benefits:

• Highly economical
• Reduces scratching due to plate/pad contamination
• Minimizes scratching from in-process handling
• Prevents staining
• Facilitates downstream cleaning processes
• Minimizes plate/pad cleaning and maintenance

Aqueous Detergents For Ultrasonic/Megasonic Cleaning

803-S | 807-S | 810-S | 813-S | 813-N | 813-NT

CHALLENGE 800 Series Products are water-based, ultrasonic/megasonic detergents formulated to increase the cavitational energy released upon substrate surfaces for more effective cleaning. Used at economical dilution ratios, CHALLENGE 800 Series Products will remove light organics and sub-micron particles. They are typically used to remove post-process residues after grinding, slicing, lapping, etching and polishing. CHALLENGE 800 Series Products can be used in heated or unheated ultrasonic tanks, and are also recommended for brush and dip tank applications.

Benefits:

• Superior wetting ability
• Free rinsing – leave no film or residue
• Economical and safe to use
• Fully compatible with other CHALLENGE products

Low Foam Detergents For Cleaning Fpd Glass And Solar Wafers

903-FPD | 910-FPD | 912-FPD | 913-FPD

CHALLENGE 910-FPD and 912-FPD are low-foaming water-based detergents formulated to perform in high pressure spray wash and brush clean applications where mechanical operation makes foam an issue, but, ultra- clean surfaces are always a necessity. These unique formulations provide the surface wetting and detergency needed to remove organic and inorganic contamination and particles from glass, ceramic and semiconductor substrates.

CHALLENGE 910-FPD is also recommended for cleaning wire saws prior to initial charging with slurry or coolant. CHALLENGE 910-FPD will clean the system thoroughly without leaving behind residue that could cause foaming of the slurry or the coolant.

Designed using dynamic contact angle measurement analysis on the latest glass substrate, CHALLENGE 900 Series products cleaning test results show cleaner glass surfaces yielding contact angles of UP DI water at below 10°.  Similar results are shown using silicon carbide, lithium niobate, and silicon substrates.

Benefits:

• Superior wetting with extremely low foam
• Free rinsing – leaves no film or residue
• Economical to use
• Fully compatible with other CHALLENGE and VECTOR products

Diamond Slurries For Polishing And Lapping Metal, Optic, And Ceramic Materials

CHALLENGE Series Diamond Slurries are composed of an aqueous based synthetic formulation developed to optimize removal rate and surface finish when lapping or polishing metal, ceramic and optical material using either a lapping plate or a polishing pad. The slurries are fully suspended and dispersed for easy application from the slurry tank to the workpiece via a peristaltic pump.

The product also contains extra lubricating qualities for difficult processes. The extra lubrication allows for use of higher speeds and pressures. Exceptionally accurate finishes can be achieved down to a polished defect free finish.

Particle sizes are available from 0.5um to 60um and are chosen dependent upon surface roughness and removal rate required. When purchasing a CHALLENGE Series Diamond Slurry, please specify diamond size and either natural or synthetic diamond or consult a sales engineer.

Typical Applications:

Lapping or polishing a variety of metal, ceramic and optical material.

Benefits:

Better surface finishes
Faster removal rates
High lubrication
Low foam
Non-staining
Contains no glycols or oils
Non-corrosive to ferrous metals

High Lubricity Synthetic Fixed-Abrasive Grinding Fluid

CHALLENGE 361-HT is a synthetic formulation developed to optimize removal rate and surface finish in grinding, sawing and fixed abrasive lapping processes using diamond grinding wheels, blades, plates and pads. The product’s exceptional heat transfer characteristics insure prolonged diamond life, even with the most difficult materials.

The product also contains extra lubricating qualities for difficult processes. The extra lubrication allows for use in grinding and fixed abrasive lapping where the wheel/plate or pad loads prematurely with grinding debris reducing material removal rate over time. CHALLENGE 361-HT is compatible with all type filtration systems allowing for extended use. Its low foam operation promotes easy application providing a laminar flow of coolant to the wheel/work-piece interface for fine finishes and prolonged tool life.

Typical Applications:

Surface, Blanchard Type, O.D./Cylindrical, Edge/Bevel/Dicing, Core Drilling, Diamond Wire Sawing, Lapping and Polishing with fixed-abrasive pads.

Benefits:

Better surface finishes
Faster removal rates
High lubrication
Low foam
Extended diamond life
Non-staining
Compatible with all filtration systems
Non-corrosive to ferrous metals